It’s never been easier to brush away your paper pieces than with the Sizzix Die Brush and Foam Pad for Wafer-Thin Dies! Create unique, intricate paper craft designs and then use this set to effortlessly remove the excess paper from your dies. This product will do the trick with all brands of wafer-thin, chemically-etched dies to leave you with a perfect, defined cut. Product Information:• Die Brush and Foam Pad• Brand: Sizzix• Easily remove paper pieces• Brush size: 14cm x 4.4cm• Foam pad size: 11cm x 18cm