Features 3D laser square hole BGA reballing stencil template High speed numerical control technology and high temperature resistant toughened materials production round square precise hole posttion make steel net more durable easier to take off the net more efficient New patented phone X Middle Layer Motherboardfor Phone X Middle layer motherboard Assisting professionals to do Phone X BGA reballing in the most convenient and safest way Specification Type A for PHone 5 5s B for PHone 6 6p C for PHone 6s 6sp D for PHone 7 7pE for PHone 8 8p Package included 1 x BGA Reballing Tool Details pictures