S500 3D BGA Reballing Stencil CPU Logic Module BGA Reballing Repair Tool for iPhone 5 5S 6 6S 7G 7Plus 8 8P
Features 3D laser square hole BGA reballing stencil template High speed numerical control technology and high temperature resistant toughened materials production round square precise hole posttion make steel net more durable easier to take off the net more efficient New patented iphone X Middle Layer Motherboardfor iPhone X Middle layer motherboard Assisting professionals to do iPhone X BGA reballing in the most convenient and safest way Specification Type A7 CPU A8 CPU A9 CPU A10 CPU A11 CPU Package included 1 x BGA Reballing Tool Details pictures
£9.91
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